Maskless Electroplating Patterning Process using Selective Electrochemical Additive Manufacturing Method for Forming of Cu Pillar Bump, Spacer and Ag Plating on Ceramic Substrate

Inhalt:
The maskless electroplating patterning process (MEPP) implementing the selective electrochemical additive manufacturing (S-ECAM) method can directly form Cu pillars with different diameters and aspect ratios, Cu spacers with large thickness and area, and selectively plate Ag on ceramic substrates without the use of the masking process. The possibility of fabricating large diameter and height Cu pillars provides very effective path for overcoming the existing limitations in the flip chip packaging. The Cu spacer can help greatly the electrical and thermal performance of double cooling packing for power chips that should operate under high-temperature environment. The selectively plated Ag pattern can be manufactured by the multi-electrode module and enhances the bonding strength between the die attach interfacial materials such as sintered Ag and ceramic substrate.