A New High Power Density 6-in-1 IGBT Module Enabling Acceleration of Vehicle Electrification

Inhalt:
In this paper, a high power density 750 V/800 A 6-in-1 IGBT module suitable for xEV application was newly proposed. In order to reduce power loss, side gate HiGTs and U-SFDs were installed that can achieve both low switching loss and low noise. In addition, the Cu lead structure was applied for down-sizing and improvement of thermal resistance. Epoxy resin encapsulation contributes to the advance of mechanical vibration resistance and thermal stress reliability. By integrating the above technologies, the developed module can achieve a −29% smaller footprint and a −27% lighter weight while keeping the same output current as our conventional IGBT module. Consequently, the developed module can realize a +70% higher power density than the conventional one.