Innovative design of automatic mold cleaning system for PC component production line
Konferenz: ISMSEE 2022 - The 2nd International Symposium on Mechanical Systems and Electronic Engineering
25.02.2022 - 27.02.2022 in Zhuhai, China
Tagungsband: ISMSEE 2022
Seiten: 4Sprache: EnglischTyp: PDF
Autoren:
Chen, Jiwen (Shandong Jianzhu University, Mechanical and Electrical Engineering & Dynamic Modular Laboratory, Jinan, China)
Xu, Qinyuan; Cheng, Jie; Zhang, Yiyun; Li, Wenchao (Shandong Jianzhu University, Mechanical and Electrical Engineering, Jinan, China)
Gao, Xiaoming (Shandong Jianzhu University, Dynamic Modular Laboratory, Jinan, China)
Inhalt:
The automatic mold cleaning system of PC components is an important link to realize the development of digital manufacturing and prefabricated building. Establish the mold driving system, the three synergistic relationship models of PC component production line, complete the motion parameter design of the automatic mold cleaning system of PC component production line, by using the electric wire rolling brush and high pressure nozzle cleaning method to complete the mold automatic cleaning system of PC component production line innovation design. Based on the finite element analysis of the support beam, the feasibility and effectiveness of the overall innovative design of the automatic mold-cleaning system are verified.