Increasing in the Output Power of IGBT Modules by Applying RC-IGBT Technology for High-Power Applications
Konferenz: PCIM Asia 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.09.2021 - 11.09.2021 in Shenzhen, China
Tagungsband: PCIM Asia 2021
Seiten: 7Sprache: EnglischTyp: PDF
Autoren:
Ebukuro, Yuta; Yamano, Akio; Kakefu, Mitsuhiro; Oda, Yuki; Mitsuzuka, Kaname; Momota, Seiji; Itoh, Taichi; Okita, Souichi; Yoshiwatari, Shinichi; Kobayashi, Yasuyuki (Fuji Electric Co. Ltd., Japan)
Inhalt:
In this paper, the output power expansion of PrimePACKTM modules for industrial applications is described. IGBT modules have been increasingly required to be smaller in size while exhibiting lower power dissipation and higher reliability. To meet the market requirements, Fuji Electric Co. Ltd. has commercialized PrimePACKTM 3+ for industrial applications which combines 7th generation X series technology and RC-IGBT (Reverse Conducting IGBT) technology that integrates a IGBT chip and a freewheeling diode (FWD) chip into one chip. The PrimePACKTM 3+ is available in 1,200V and 1,700V ratings. Both rated products have significantly improved power dissipation and reliability compared with conventional PrimePACKTM. With these improvements, the output power expansion that is difficult with the conventional IGBT and FWD combination module has been achieved.