Modeling and Thermal Analysis of Cooling Solutions for High Voltage SMD Packages
Konferenz: PCIM Europe digital days 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
03.05.2021 - 07.05.2021 in Online
Tagungsband: PCIM Europe digital days 2021
Seiten: 8Sprache: EnglischTyp: PDF
Autoren:
Mauromicale, Giuseppe (STMicroelectronics, Italy & University of Catania, Italy)
Nardo, Domenico; Scuto, Alfio; Sorrentino, Giuseppe; Abbatelli, Luigi (STMicroelectronics, Italy)
Scelba, Giacomo; Scarcella, Giuseppe; Pagano, Arturo (University of Catania, Italy)
Inhalt:
In this work, an experimental investigation on thermal behavior of TO-LL, D2PAK, and H2PAK surface- mount device (SMD) packages is presented, by considering different number of PCB layers, different copper pads number and thickness, and thermal vias number and diameter. Moreover, an effective thermal equivalent circuit model has been investigated and validated with the experimental measurements, obtaining a good compromise between accuracy and computational burden.