Heat Dissipation Performance Evaluation of Insulated Metal Substrate Based on Transient Analysis
Konferenz: PCIM Europe digital days 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
03.05.2021 - 07.05.2021 in Online
Tagungsband: PCIM Europe digital days 2021
Seiten: 5Sprache: EnglischTyp: PDF
Autoren:
Wei, Si; Wu, Yibo; Ke, Haotao; Dong, Guozhong; Deng, Yueping; Chang, Guiqin; Peng, Yongdian; Luo, Haihui (State Key Laboratory of Advanced Power Semiconductor Devices, Zhuzhou, Hunan, China & Zhuzhou CRRC Times Semiconductor Co.,Ltd., Zhuzhou, Hunan, China)
Wang, Yangang (Power Semiconductor R&D Centre，Dynex Semiconductor Ltd, Lincoln, UK)
Inhalt:
Abstract It was reported that much lower thermal resistance can be obtained if insulated metal substrate(IMS) technology was applied in power modules due to its simplified structure. However, it was found that the transient thermal response of IMS is not as effective as ceramic package system. The main work of this pater is to find a explicit method to evaluate the transient heat dissipation performance of power modules based on surge tests and provide a solution to improve the transient thermal performance of IMS package system.