Bonding Properties of Cu Sinter Paste for Pressureless Sintering Process

Inhalt:
We have developed a new Cu sintered material that can be pressureless bonded in nitrogen at low temperature. Sintering under 260deg C to 300deg C for 30 minutes in a nitrogen atmosphere without pressure resulted in a high shear strength of over 20MPs when printed between 2mm x 2mm Ag-metallized SiC die and TO-247 bare-Cu substrate. Furthermore, the scanning acoustic tomography image of the sintered layer showed good sintered structure and almost no void. These results suggest that this newly developed Cu paste is a promising material as a bonding material for power electronics.