Development of the Laser Beam Based High-Current Contacting Technology and an Integrated Lead Frame Stack Structure
Konferenz: PCIM Europe digital days 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
03.05.2021 - 07.05.2021 in Online
Tagungsband: PCIM Europe digital days 2021
Seiten: 8Sprache: EnglischTyp: PDF
Autoren:
Chung, Woo-Sik; Helm, Johanna; Olowinsky, Alexander (Fraunhofer Institute for Laser Technology ILT, Germany)
Bast, Markus; Goerdes, Jan Philipp; Eisele, Ronald (University of Applied Sciences Kiel, Germany)
Becker, Martin; Osterwald, Frank (Danfoss Silicon Power GmbH, Germany)
Schellenberg, Christian; Wilke, Klaus (Siemens AG, Germany)
Inhalt:
High-performance switching elements in power electronics are a decisive element for the performance of converters and control elements in E-mobility and renewable energy systems. The packaging and interconnection technology requires a high current carrying capacity with efficient thermal management to ensure long-term stability and high performance. In this paper, a new development of laser beam based high-current contacting technology and an integrated lead frame stack structure for efficient heat dissipation is investigated. The purpose of this development is to increase the power and integration density of power semiconductor devices while simultaneously improving the switching properties in high frequency switching processes.