Optimization of Properties Thermal Compensators from MMC AlSiC for Thyristors and IGBT modules
Konferenz: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.07.2020 - 08.07.2020 in Deutschland
Tagungsband: PCIM Europe digital days 2020
Seiten: 5Sprache: EnglischTyp: PDF
Autoren:
Nishchev, Konstantin; Novopoltsev, Mikhail (National Research Ogarev Mordovia State University, Russia)
Malygin, Mikhail; Nesterov, Evgeny; Osipova, Evgenia; Pyshkov, Denis (PJSC Electrovipryamitel, Russia)
Inhalt:
This paper presents results of studies aimed at improving the properties of thermal compensators and heat-conducting baseplates made of metal matrix composite AlSiC, based on the requirements for press-pack semiconductor devices and soldered IGBT modules operating in cyclic modes.