New ST’s package TO-LL and MDmesh(TM) DM6: the right choice for high level SMPS

Inhalt:
This paper presents ST’s new TO-LL (TO-lead less) SMD package and its benefits in terms of thermal management, PCB area, switching performance and parasitic inductance on the leads. The evaluation begins with an overview of SMD packages, and concludes with an application analysis of SMPS, PFC and LLC stages. The combination of TO-LL and ST’s latest MDmesh(TM) DM6 super-junction technology increases efficiency with very small switch-off energy, best RDS(on) x area, reliability, robustness and an increase of power density.