Thermal Solutions for Surface Mount Power Devices

Inhalt:
The first part of the paper presents a Printed Circuits Board (PCB) thermal vias design recommendations for surface mount (SMT) power devices for relatively low power applications. Simulation is conducted to compare different thermal vias arrays. A PCB with different thermal vias array is fabricated, and thermal impedance is measured. The measured result confirms simulation results. The second part of the paper introduces an innovative ceramic-embedded Alumina Nitride (AlN) FR4 PCB solution for surface mount power devices in high power applications. This embedded AlN PCB solution provides excellent thermal conduction, and electrical isolation at same time. A simulation work is also conducted. And PCB is manufactured to verify the simulation result. Finally, a 6.6kW EV on-board charger power converter is developed based on this AlN-embedded PCB.