Novel Joining Technologies in Traction Power Semiconductor Modules for Fulfillment of Roll2Rail Requirements

Inhalt:
Power semiconductor modules undergo extreme thermal excursions, which require reliable joining connections. Enhanced customer requirements like the Roll2Rail target specification for future traction applications are enforcing the replacement of standard joining technologies. In this work, the power cycling reliability of IGBT devices was investigated, whereby the emitter contact was prepared by novel bond wires and the chips were sintered to substrates. A significant improvement of the reliability was achieved compared to samples having conventional aluminum wire bonding and soldering connections, indicating a fulfillment of Roll2Rail. In addition, this paper also presents the evaluation of a power cycling test done on substrate level and the translation method to a large power module with base plate and several substrates.