Design And Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam

Inhalt:
This paper presents material characterizations of PCB-embedded dies packaging in which connections are made using a pressed metal foam. In fact, the solder joints and wire bonds have been removed and replaced with a pressed conductive foam to connect the top and bottom sides of a power die. PCB embedding technology reduces stray inductances and the process remains cost-effective. A description of the manufacturing process is presented along with electrical, thermal and mechanical characterizations of the obtained contacts based on copper and nickel foam. Then, according to the obtained results, a choice of the appropriate materials is proposed.