7th Generation High Reliability HPnC module for Traction Applications
Konferenz: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.07.2020 - 08.07.2020 in Deutschland
Tagungsband: PCIM Europe digital days 2020
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Yoshida, Keniti; Ichikawa, Hiroaki; Chen, Shuangching; Takaku, Taku; Kobayashi, Yasuyuki; Okita, Souichi; Onozawa, Yuichi (Fuji Electric Co., Ltd., Japan)
Schneider, Deborah; Kawabata, Junya (Fuji Electric Europe GmbH, Germany)
Inhalt:
Power conversion systems, which are using power semiconductors, are spreading in various fields. Especially in the traction field the requirements for higher current density, conversion efficiency and reliability are increasing. To fulfill those requirements, Fuji Electric has developed 1700V and 3300V “High Power next Core” (HPnC) IGBT modules based on the 7th generation “X Series” chip technology. Thus, the power dissipation has been reduced while the power density has been increased. A base plate with low linear expansion coefficient as well as ultrasonic bonding technology are used to improve the thermal power cycling capability and hence realize a higher reliability of the module.