Latest IGBT4 chip technology enables the first 2000 A 3300 V module in IHV package
Konferenz: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.07.2020 - 08.07.2020 in Deutschland
Tagungsband: PCIM Europe digital days 2020
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Jadhav, Vishal; Mansueto, Sergio; Buerger, Matthias; Schwarzer, Ulrich; Car, Diana; Felsl, Hans-Peter (Infineon Technologies AG, Germany)
Soellradl, Thomas; Kurzmann, Thomas (Infineon Technologies Austria AG, Austria)
Inhalt:
The Industrial High Voltage (IHV) package has been the most reliable building block in high-power, highvoltage applications like traction, high-voltage DC transmission (HVDC) and medium-voltage drives (MVD). The latest IGBT4 chip technology combined with an optimized internal layout offers the first 2000 A 3300 V module in this package, raising the current density by 33% in comparison to the state-of-the-art 1500 A 3300 V IHV module. This paper depicts the electrical and thermal performance of the IGBT4 and EC4 diode technology in the IHV housing and its application benefits.