Fiber-chip coupling for advanced microsystems
Konferenz: Smart Systems Integration - 13th International Conference & Exhibition on Integration Issues of Miniaturized Systems
10.04.2019 - 11.04.2019 in Barcelona, Spain
Tagungsband: Smart Systems Integration
Seiten: 4Sprache: EnglischTyp: PDF
Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Autoren:
Moeller, Christian; Ortlepp, Hans-Georg; Neckermann, Kristin; Klein, Thomas; Ortlepp, Thomas (CiS Forschungsinstitut für Mikrosensorik GmbH, Konrad-Zuse-Straße 14, 99099 Erfurt, Germany)
Inhalt:
Fiber coupling of optical microsensors offer advantages like increased sensitivity and geometric versatility to enable application in high voltage, electrically noisy, high/low temperature and many others. In this paper we introduce a silicon wafer based fiberchip coupling. Optical sensors can be coupled with a silicon carrier wafer via flip-chip mounting. The silicon carrier wafer enables electrical contact to the sensor and a defined optical fiber mounting. As examples for the technology, we present a flip-chip assembly of a superconducting single photon detector and a miniaturized fiber Bragg grating sensor.