Silicone-Based Enablers for Thermal Management in Power Electronics

Inhalt:
Smaller form factors and higher power densities are part of the key drivers for the continuous improvement of electronic systems. Part of the success of the development and implementation of such new technologies imparts to the development of thermally conductive materials required to handle the heat management. This presentation highlights silicone-based products (encapsulants, gap fillers and adhesives) that have been engineered to meet these thermal management needs.