Analysis of thermal performances of a power module in PQFN package vs. PCB characteristics

Inhalt:
An experimental analysis of the thermal behaviour of the innovative, patented IR muIPM(TM) module [1] depending on PCB characteristics is here reported and discussed. These modules typically exploit the PCB for thermal dissipation and without using any heatsink. The goal of these measurements is to realize a simple thermal model for the system (module and PCB) based on experimental data and able to be provided indications for final applicative system board design. The thermal behavior of the muIPM(TM) has been observed changing copper characteristics (area and thickness) around the module, ambient conditions and considering different levels of power dissipation. Trends curves for both module temperature and thermal resistance are provided and discussed. Pratical aspects of this investigation are reported and commented.