p2 Pack - the Paradigm Shift in Interconnect Technology
Konferenz: PCIM Europe 2014 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
20.05.2014 - 22.05.2014 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2014
Seiten: 9Sprache: EnglischTyp: PDF
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Autoren:
Gottwald, Thomas; Roessle, Christian (Schweizer Electronic AG, Einsteinstr. 10, 78713 Schramberg, Germany)
Inhalt:
Miniaturization of Power Electronic modules requires the minimization of losses and optimized power dissipation. With the p² Pack technology it is possible to build ultra-thin modules with a thickness of 1-1.4 mm which have less losses and improved power dissipation characteristics by using embedding technologies and processes of the Printed Circuit Board industry.