Low-inductive compact SiC power modules for high-frequency operation
Konferenz: PCIM Europe 2014 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
20.05.2014 - 22.05.2014 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2014
Seiten: 8Sprache: EnglischTyp: PDF
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Autoren:
Meisser, Michael; Blank, Thomas (Institute for Data Processing and Electronics, Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany)
Hamilton, Dean; Mawby, Philip (Peater Lab, School of Engineering, Warwick University, Coventry, United Kingdom)
Inhalt:
This paper encompasses the design, manufacture and electrical characterisation of full-SiC half-bridge modules suited for high-frequency operation. The modules consist of stacked AlN DCB substrates equipped with SiC MOSFETs and SiC JFETs. The parasitic inductances of the modules were minimised by the use of a press contact system instead of contact leads. The low parasitic inductances of the modules were verified by simulation and impedance spectroscopy. Modules with different configurations are compared regarding their current- and temperature-dependent static losses by means of a temperature-controlled test rig. The measured low on-resistance of the individual switches proves the high performance of the modules predicted by thermal simulations.