Achievements and perspectives of the DRIE technology for the Microsystems
Konferenz: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
09.04.2008 - 10.04.2008 in Barcelona, Spain
Tagungsband: Smart Systems Integration 2008
Seiten: 3Sprache: EnglischTyp: PDF
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Autoren:
Puech, M.; Thevenoud, J. M.; Gruffat, J. M.; Launay, N.; Godinat, P.; Barillec, O. Le (Alcatel Micro Machining Systems, Annecy, France)
Inhalt:
More than a decade ago, DRIE (Deep Reactive Ion Etching) of silicon appeared as a key enabling technology for the emerging MEMS industry. Derived from the semiconductor plasma etching tools, the DRIE has been adapted to the specific needs of the micro-machining of silicon involved in the structuring of large and high aspect ratio features.