A New Method of Fabrication of Heat Transfer Surfaces with Micro-Structured Profile
Konferenz: Mikrosystemtechnik Kongress 2005 - Mikrosystemtechnik Kongress 2005
10.10.2005 - 12.10.2005 in Munich, Germany
Tagungsband: Mikrosystemtechnik Kongress 2005
Seiten: 2Sprache: EnglischTyp: PDF
Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Autoren:
Schulz, Andreas (SDK-Technik GmbH, 06484 Quedlinburg, Sachsen-Anhalt, Deutschland)
Inhalt:
The micro-structured heat transfer surface is a completely new developed product. Tubes, plates and more metallic profiles with nano- and microstructured surfaces cause a high boiling and heat transfer rate and can be applied in systems of cooling technology. Metallic profiles of copper, aluminium and steel can be treated by the micro-structuring technique. Depending on the physical conditions of the boiling process, the parameters of the micro-structure are adjustable. Pressure, temperature and the type of the liquid coolant determine the choice of the area density as well as height and radius of the micro-structure elements to reach the maximum vapour bubble rate and heat flux on surface.