Design of a Test Assembly for Evaluation of a Transimpedance Amplifier IC and Performance Optimization

Inhalt:
This paper presents a test assembly for electrical evaluation of a Transimpedance Amplifier (TIA) to be used in fiber-optical communication link. The assembly allows the use of conventional microwave measurement equipment for characterization instead of optical measurement equipment. The influence of pad layout arrangement and of bond wire coupling when mounting the die on either a Printed Circuit Board (PCB) or in a TO-can has been studied. It is shown that asymmetry in the mounting can severely deteriorate the overall circuit performance. The recommendations for assembly as proposed by simulations could be verified by measurements.