Influence of Printing Resolution and Curing Time on the Dielectric Properties of SLA-Prints

Konferenz: VDE Hochspannungstechnik - 5. ETG-Fachtagung
11.11.2024-13.11.2024 in Berlin, Germany

Tagungsband: ETG-Fb. 175: VDE Hochspannungstechnik 2024

Seiten: 4Sprache: EnglischTyp: PDF

Autoren:
Kahn, Maik; Kurrat, Michael

Inhalt:
In this publication, the additive manufacturing process of stereolithography (SLA) is investigated. The samples were manufactured with different layer thicknesses and curing times to analyse their effect on the dissipation factor and relative permittivity. The results show that non-cured samples significantly deviate from cured samples. A curing time of 30 minutes proved to be optimal for improving the dissipation factor and relative permittivity. These properties make the used resin a customizable insulating material. This paper provides valuable insights for optimizing the SLA process and manufacturing insulating materials.