Solder-Reflow Resistant Thermoplastic Resin Single-Mode Micro-Lens Array for Integrated Photonic Packaging
Konferenz: ECOC 2024 - 50th European Conference on Optical Communication
22.09.2024-26.09.2024 in Frankfurt, Germany
Tagungsband: ITG-Fb. 317: ECOC 2024
Seiten: 4Sprache: EnglischTyp: PDF
Autoren:
Gradkowski, K.; Hoogland, G.; Jung, F.; Choi, YJ.; van Gisbergen, J.; Johnson, PM.; Pitwon, R.; Hartwig, A.; Koh, R.; O'Brien, P.
Inhalt:
We demonstrate a pluggable optical coupling between a fibre array and a photonic integrated circuit (PIC) using single-mode microlens arrays (MLAs) moulded from a solder-reflow resistant thermo-plastic resin. This demonstration offers a potential for co-packaged optics, with easy to scale, and rela-tively low cost MLAs.