Automating Photonic Systems-in-Package Assembly for High Performance Glass Interposers
Konferenz: ECOC 2024 - 50th European Conference on Optical Communication
22.09.2024-26.09.2024 in Frankfurt, Germany
Tagungsband: ITG-Fb. 317: ECOC 2024
Seiten: 4Sprache: EnglischTyp: PDF
Autoren:
Shortiss, Kevin; Hwang, How Yuan; Parra, Josue; Butler, Sharon; Wang, Hsiang-Chu; Ghomashi, Mohammadamin; Li, Yanlu; Noell, Wilfried; Seyfried, Moritz; O'Brien, Peter
Inhalt:
Interest in high performance glass interposers has been growing, due to the advantages which have been demonstrated over standard silicon interposers. In this paper, we demonstrate fully auto-mated micro-optics and laser sub-assembly alignment and laser-assisted bonding processes which are compatible with glass interposers.