Thermal coupling assessment for a PCB-based package with embedded chips and graphite heat spreader
Konferenz: CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
12.03.2024-14.03.2024 in Düsseldorf, Germany
Tagungsband: ETG-Fb. 173: CIPS 2024
Seiten: 7Sprache: EnglischTyp: PDF
Autoren:
Ahmed, Ahmed Sabry Eltaher; Hamed, Bahaeddine Ben; Perrin, Remi; Regnat, Guillaume; Lefevre, Guillaume (Mitsubishi Electric R&D Centre Europe, Rennes, France)
Buttay, Cyril (CNRS, INSA Lyon, Ecole Centrale de Lyon,Universite Claude Bernard Lyon1, Ampère, UMR 5005, Villeurbanne, France)
Jay, Jaques (CNRS, INSA Lyon, CETHIL, UMR 5008, Villeurbanne, France)
Inhalt:
A graphite heat spreader designed to be compatible with printed circuit board (PCB) embedding technology is demonstrated. It is suited to wide-bandgap devices and high-power loss density requirements (> 500 W/cm2). PCB samples integrating a graphite heat spreader stack are designed and fabricated then compared to a reference sample, through both simulation and experimental analysis. It is found that the graphite spreader reduces thermal resistance by up to 38 %, while increasing thermal coupling between adjacent chips by 3-fold.