Investigation of Moisture Absorption and Drying Characteristics of HVIGBT Power Modules
Konferenz: CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
12.03.2024-14.03.2024 in Düsseldorf, Germany
Tagungsband: ETG-Fb. 173: CIPS 2024
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Sakai, Yasuhiro; Mikami, Kazuto; Hatori, Kenji; Nakamura, Keiichi; Oya, Daisuke (Mitsubishi Electric Corporation, 1-1-1 Imajukuhigashi, Nishi-Ku, Fukuoka, Japan)
Soltau, Nils (Mitsubishi Electric Europe B.V., Germany)
Inhalt:
Moisture resistance is a critical concern for non-hermetic HVIGBT modules. Understanding the moisture absorption behavior of silicone gel inside the power module is essential for its design. HVIGBT modules are filled with silicone gel that acts as a filtering agent, and obstacles such as terminals may hinder moisture transfer from the gel surface to the chip. This paper explains a method for calculating the moisture absorption behavior of silicone gel near the chip location covered by obstacles using a one-dimensional model. Finally, we verify the condensation risk in HV100 power modules for traction applications using this method.