Investigation on failure mechanisms of a PCB based package using DC active power cycling

Inhalt:
This paper presents the design, cycling test and analysis results of an integrated power board with silicon IGBT and freewheeling diode embedded dies. This board relies on the printed circuit board (PCB) embedding technique using via interconnection and standard PCB stack arrangement. The reliability study is done using DC active cycling test bench to obtain 100deg C temperature swing up to 2.6 million cycles. The paper also introduces, through a comprehensive study of the packaging degradation, several hypotheses for the root cause analysis of the degradation mechanisms identified.