Stray Inductance of a Modular Switching Cell Designed for Easier Disassembly
Konferenz: CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
12.03.2024-14.03.2024 in Düsseldorf, Germany
Tagungsband: ETG-Fb. 173: CIPS 2024
Seiten: 8Sprache: EnglischTyp: PDF
Autoren:
Ferber, Moises (Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, Grenoble, France & Universidade Federal de Santa Catarina, Joinville, Brazil)
Bruyere, Paul (Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, Grenoble, France & Univ Lyon, Ecole Centrale de Lyon, INSA Lyon Université Lyon 1, CNRS, Ampère , Ecully, France)
Botter, Nicolas; Guichon, Jean-Michel; Schanen, Jean-Luc; Derbey, Alexis; Avenas, Yvan (Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, Grenoble, France)
Can, Alejandro; Combettes, Celine; Bley, Vincent; Sarraute, Emmanuel (University of Toulouse, UT3 Paul Sabatier, LAPLACE Toulouse, France)
Bouzerd, Souhila; Dupont, Laurent (SATIE laboratory, Univ. Gustave Eiffel, Versailles, France)
Vagnon, Eric (Univ Lyon, Ecole Centrale de Lyon, INSA Lyon Université Lyon 1, CNRS, Ampère, Ecully, France)
Inhalt:
This paper introduces the concept of a new packaging concept, TAPIR, compacT and modulAr Power modules with IntegRated cooling in an improved version. In comparison with the first generation, the manufacturability, disassembly for easier end of life processing and expected reliability have been targeted. However, these modifications lead to a change in the electrical path of the switching cell, which might increase the stray inductance of the power module. This work therefore proposes a deep investigation of all geometrical parameters involved in the TAPIR#2 design, in order to estimate if the increase of the stray inductance is acceptable. All results will be very helpful for a global design including the tradeoff between electrical, thermal and mechanical behaviours.