Metal-Air-FR4 Electrical Field Management with Embedded Electrical Field Plates for PCB Embedded Power Electronics
Konferenz: CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
12.03.2024-14.03.2024 in Düsseldorf, Germany
Tagungsband: ETG-Fb. 173: CIPS 2024
Seiten: 7Sprache: EnglischTyp: PDF
Autoren:
Avenas, Yvan (Univ. Grenoble Alpes, CNRS, Grenoble INP*, G2Elab, Grenoble, France)
Bruyere, Paul (Univ. Grenoble Alpes, CNRS, Grenoble INP*, G2Elab, Grenoble, France & Ecole Centrale de Lyon, INSA Lyon, Universite Claude Bernard Lyon 1, CNRS, Ampère, Ecully, France)
Vagnon, Eric; El Khattabi, Mohamed (Ecole Centrale de Lyon, INSA Lyon, Universite Claude Bernard Lyon 1, CNRS, Ampère, Ecully, France)
Inhalt:
The objective of this paper is to study Metal-Air-FR4 triple point management for the development of three-dimensions (3D) power modules based on printed circuit boards (PCB). Capacitive field grading structure is introduced to shift the high electrical field area from the triple point in the air to the FR4 PCB resin. The concept is firstly exposed with finite element simulations, and different field plate architectures are compared. Experiments are then carried out. They show that the Partial Discharge Inception Voltage and Breakdown Voltage can be increased at least by +248% and +8.2% respectively compared to PCB without field plates.