Silver and Silver-Copper mixed pastes for application in die- and substrate attach

Inhalt:
Silver sintering has been known for die-attach applications for several years and can be considered already as state of the art. The large-area sintering of substrates to the heat sink, on the other hand, is relatively new and currently of great interest. This bonding layer, which is many times larger in area and in most cases with a higher bond line thickness, presents users with significantly greater challenges. In addition to this, sintering of copper-bearing materials has been experiencing enormous interest for some time. Higher reliability and lower prices are the main drivers of this new technological variant of sintering pastes. However, this is offset by higher costs and more complex process structures. In addition, current nano-based copper pastes cannot yet fully meet the industry's price requirements. This paper presents the latest results on large area sintering and silver-copper mixed pastes with low total-cost-of-ownership.