Application of Mathematical Inverse Analysis in MEMS Testing

Konferenz: MikroSystemTechnik Kongress 2023 - Kongress
23.10.2023-25.10.2023 in Dresden, Deutschland

Tagungsband: MikroSystemTechnik Kongress 2023

Seiten: 4Sprache: EnglischTyp: PDF

Autoren:
Mueller, Juergen; Heringhaus, Monika; Messner, Dominik; Northemann, Thomas (Robert Bosch GmbH, Reutlingen, Germany)

Inhalt:
Current MEMS applications (e.g., navigation) impose enormous requirements regarding production maturity and device characterization. Analysis accuracy is guaranteed, using high fidelity system differential equations (SDE) and mathematical methods to identify the individual physical properties of the device under test (DUT). MEMS testing thus evolved from heuristic sorting to stringent ‘Mathematical Inverse Analysis’. This paper presents the concepts and defining relations of inverse analysis and its adaption to MEMS testing. Examples from the area of dynamic characterization are presented and the application of the techniques to build in self-test of autonomous devices with computing and control options (e.g., muC) is discussed.