Improving the recyclability of printed electronics
Konferenz: MikroSystemTechnik Kongress 2023 - Kongress
23.10.2023-25.10.2023 in Dresden, Deutschland
Tagungsband: MikroSystemTechnik Kongress 2023
Seiten: 2Sprache: EnglischTyp: PDF
Autoren:
Janek, Florian; Groezinger, Tobias; Glaeser, Kerstin (Hahn-Schickard-Gesellschaft für angewandte Forschung, Stuttgart, Germany)
Brasse, Yannic (INM – Leibniz Institute for New Materials, Structure Formation Group, Saarbrücken, Germany)
Kraus, Tobias (INM – Leibniz Institute for New Materials, Structure Formation Group, Saarbrücken, Germany & Saarland University, Professorship for Colloid and Interface Chemistry, Saarbrücken, Germany)
Emmerechts, Carl (Sirris, Liège Science Park, Seraing, Belgium)
Clanet, Jean.Michel; Grymonprez, Benoit (CTP Centre Terre et Pierre, Tournai, Belgium)
Inhalt:
Results achieved in the Cornet project “ReIn-E” towards easier recyclability of printed electronics are demonstrated. This includes the introduction of a low-cost, water soluble polymeric separation layer. Polyvinyl alcohol (PVA) paste and PVA ink were manufactured for screen-printing as well for inkjet printing. Commercial silver ink can be printed on top of printed PVA to form conductive tracks. Bending tests showed that the introduced PVA layer reduces mechanical stress onto the printed tracks and therefore can increase the reliability of printed electronics. Standard recycling procedures were used to demonstrate the suitability of PVA for the separation of plastics and metals used for printed electronics parts.