Monolithic integration of permanent magnets in SOI-based micro-mechanisms
Konferenz: MikroSystemTechnik Kongress 2023 - Kongress
23.10.2023-25.10.2023 in Dresden, Deutschland
Tagungsband: MikroSystemTechnik Kongress 2023
Seiten: 4Sprache: EnglischTyp: PDF
Autoren:
Schmitt, Philip; Hoffmann, Martin (Ruhr-Universität Bochum, Lehrstuhl Mikrosystemtechnik, Bochum, Germany)
Gojdka, Bjoern; Lisec, Thomas; Ziegler, Florian (Fraunhofer ISIT, MEMS Development, Itzehoe, Germany)
Orlandini-Keller, Frederico; Devillers, Thibaut; Dempsey, Nora M. (Université Grenoble Alpes, CNRS, Grenoble INP, Institut Néel, Grenoble, France)
Inhalt:
In this paper, we report two different fabrication technologies for integrating hard magnetic material into Silicon-on-Insulator (SOI) substrates. The first approach involves the deposition of NdFeB through sputtering, while the second method focusses on inserting NdFeB powder into pre-etched cavities of an SOI substrate and subsequent agglomeration by ALD. We demonstrate the implementation of these process flows within a typical MEMS SOI technology process. Applying these two fabrication techniques, we demonstrate the fabrication and characterization of a micromagnetic transducer which allows to convert an external magnetic field into a force and displacement within a microsystem.