Implantable Thermoelectric Generator with High Aspect Ratio Thermolegs and Integrated Voltage Converter
Konferenz: MikroSystemTechnik Kongress 2023 - Kongress
23.10.2023-25.10.2023 in Dresden, Deutschland
Tagungsband: MikroSystemTechnik Kongress 2023
Seiten: 4Sprache: EnglischTyp: PDF
Autoren:
Rao, Yongchen; Bechthold, Tamara (Institute for Electronic Appliances and Circuits, University of Rostock, Germany & Jade University of Applied Sciences, Department of Engineering, Wilhelmshaven, Germany)
Voss, Matthias; Hohlfeld, Dennis (Institute for Electronic Appliances and Circuits, University of Rostock, Germany)
Inhalt:
This paper reports on a miniaturized thermoelectric generator (TEG), which integrates 16×16 high aspect ratio thermolegs for sufficient voltage delivery from low temperature gradients. The TEG has been designed to yield the thermal resistance required for maximum power delivery in a medical implantation scenario. A novel assembly approach has been developed for aligning high aspect ratio thermolegs during reflow soldering. We further present a TEG design, which integrates a boost converter circuit for providing voltage levels suitable for powering medical implants. The applicability has been confirmed through both experiments and simulations of a TEG embedded in the human cranial bone.