Integration of LTCC into Printed Circuit Boards for Trustworthy Electronics
Konferenz: MikroSystemTechnik Kongress 2023 - Kongress
23.10.2023-25.10.2023 in Dresden, Deutschland
Tagungsband: MikroSystemTechnik Kongress 2023
Seiten: 4Sprache: EnglischTyp: PDF
Autoren:
Schroeter, Annett; Krieger, Uwe (VIA electronic GmbH, Hermsdorf, Germany)
Lehnberger, Christoph (ANDUS ELECTRONIC GmbH, Berlin, Germany)
Uhlig, Peter (IMST GmbH, Kamp-Lintfort, Germany)
Goldberg, Adrian (Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Dresden, Germany)
Inhalt:
Sustainable and trustworthy applications gaining significance in electronics, a fast-growing industry itself. The integration of well-established robust materials, like low temperature cofired ceramics (LTCC), into printed circuit boards (PCB) can prolong lifetimes, enhance safety, and improve properties of the assemblies, e.g. RF applications. Thus, new safety elements are designed within the context of the project VE-CeraTrust.