Hydrogen Release from PECVD Thin Films in MEMS Cavities

Konferenz: MikroSystemTechnik Kongress 2023 - Kongress
23.10.2023-25.10.2023 in Dresden, Deutschland

Tagungsband: MikroSystemTechnik Kongress 2023

Seiten: 4Sprache: EnglischTyp: PDF

Autoren:
Dani, Prafullkrishna Kiran; Franz, Jochen; Knoch, Joachim (Robert Bosch GmbH, Reutlingen, Germany)

Inhalt:
In this work, we study the release of hydrogen from PECVD thin films in MEMS based hermetically sealed cavities. Cavity pressure of test chips is determined experimentally. Estimation is also made using simulation based on material models for hydrogen release from PECVD silicon nitride and silicon oxide. The role of barrier films in prevention of change in cavity pressure is discussed. Simulation results help in providing insights on other potential implications related to hydrogen release and barrier films.