Place and bend assembly of photonic modules
Konferenz: MikroSystemTechnik Kongress 2023 - Kongress
23.10.2023-25.10.2023 in Dresden, Deutschland
Tagungsband: MikroSystemTechnik Kongress 2023
Seiten: 3Sprache: EnglischTyp: PDF
Autoren:
Grueger, Heinrich; Knobbe, Jens; Koch, Sandro G. (Fraunhofer IPMS, Dresden, Germany)
Schulz, Marlon; Sdrenka, Sebastian (Clausthaler Zentrum für Materialtechnik, TU Clausthal, Clausthal, Germany)
Ziegmann, Gerhard (Institut für Polymerwerkstoffe und Kunststofftechnik, TU Clausthal, Clausthal, Germany)
Inhalt:
The integration of complex optical systems can be challenging, especially for off-axis designs. Fraunhofer IPMS invented a concept to integrate such systems by placing the optical components on a mostly planar substrate featuring preprocessed bending lines. Folding up the walls generates the body with the optical path inside. The method has been called “place and bend assembly”. After finishing the proof of concept using 3D printed substrates, now the development of injection-molded structures has been started. It is aimed to integrate functional and optical surfaces directly into the substrates as well as to cut down the system effort furthermore.