Mission Profile Requirements for Power Electronic Modules and Design Solutions

Inhalt:
After an overview of exemplary mission profiles, the paper explains the general concept of reliability engineering, and provides a review of widely accepted acceleration models for frame-based power semiconductor modules. To exemplify state-of-the-art reliability modelling, two use cases are explored in greater detail: thermomechanical and environmental mission profiles and their impact on lifetime consumption. The authors also briefly present some examples of underlying fatigue modes (physics of failure) for these two stress modes.