Contact Resonance Imaging with Vertical Nanowire Arrays
Konferenz: Sensoren und Messsysteme - 21. ITG/GMA-Fachtagung
10.05.2022 - 11.05.2022 in Nürnberg
Tagungsband: ITG-Fb. 303: Sensoren und Messsysteme
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Fahrbach, Michael; Xu, Jiushuai; Peinera, Erwin (Technische Universität Braunschweig, Institute of Semiconductor Technology (IHT) and Laboratory for Emerging Nanometrology (LENA), Braunschweig, Germany)
Klapetek, Petr (Czech Metrology Institute, Brno & CEITEC BUT, Brno, Czech Republic)
Martinek, Jan (Czech Metrology Institute, Brno & Brno University of Technology, Faculty of Civil Engineering, Czech Republic)
Inhalt:
A setup for high-throughput measurement of dimensional and mechanical parameters of silicon microwire and resist nanowire arrays is used for combined topography and contact resonance imaging. It is based on customized long slender piezoresistive silicon microprobes designed for in-line measurements of industrial workpieces. In measurements with microwire and nanowire arrays we found sub-µm resolution on large areas (300 x 300 micrometer2) at high speed up to 300 µm/s. Using a mass-spring model, characteristic features of contact-resonance imaging with slender microprobes were simulated.