Integrated High Temperature Electronics for Sensors in Harsh Environments
Konferenz: Sensoren und Messsysteme - 21. ITG/GMA-Fachtagung
10.05.2022 - 11.05.2022 in Nürnberg
Tagungsband: ITG-Fb. 303: Sensoren und Messsysteme
Seiten: 3Sprache: EnglischTyp: PDF
Autoren:
Kordas, N.; Kappert, H. (Fraunhofer Institute for Microelectronic Circuits and Systems IMS, Duisburg, Germany)
Inhalt:
As part of the Fraunhofer Lighthouse project "eHarsh" conducted by eight Fraunhofer institutes, a universal chipset was designed for the readout of sensors in harsh environments. The SOI-CMOS technology used was especially developed for high-temperature applications and allows operating temperatures of up to 300 °C. The chipset consists of an analogue sensor front-end IC for resistive sensors, a microcontroller and an interface IC. Measurements of the analog frontend IC show functional performance up to 300 °C and only a slight decrease of the measured SNR from 87 dB at 25 °C to 84 dB at high temperatures.