Miniaturized Infrared lenses by wafer bonding technologies

Inhalt:
This paper presents a novel technology platform to fabricate miniaturized Silicon optics by embedding hundreds of Si spheres on wafer level. The exact curvature of spherical preforms which are subsequently grinded to form a plano-convex lens, promises excellent optical properties for IR spot detectors and could eliminate the need for expensive 100 % optical measurements in manufacturing. The transmission properties of the Si lenses were evaluated using a commercially available IR sensor. The technology provides a new dimension to product designers on the system level and could ease the integration of IR sensors into consumer elec tronics.