A New Development of Micro-Copper Sinter Material for High Power Electronics Application
Konferenz: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
24.03.2020 - 26.03.2020 in Berlin, Deutschland
Tagungsband: ETG-Fb. 161: CIPS 2020
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Schwarzer, Christian (Aschaffenburg University of Applied Sciences, Würzburger Straße 45, 63743 Aschaffenburg, Germany & Heraeus Deutschland GmbH & Co. KG, Hanau, Germany)
Chew, Ly May (Heraeus Deutschland GmbH & Co. KG, Hanau, Germany)
Stoll, Thomas; Franke, Joerg (Institute for Factory Automation and Production Systems (FAPS), Friedrich-Alexander-University Erlangen-Nuremberg, Nuremberg, Germany)
Kaloudis, Michael (Aschaffenburg University of Applied Sciences, Würzburger Straße 45, 63743 Aschaffenburg, Germany)
Inhalt:
Copper is touted as an alternative die attach material. This study investigates the main parameters of a pressure sintering process using micro-scale copper sinter material as well as the behavior of the interconnection during thermal cycling by measuring the die shear strength and evaluating the microstructure of sintered copper layer. It was found that at 300deg C a sintered joint is formed within 2 min. Furthermore, thermal cycling in a liquid-to-liquid shock test showed that only a slight decreased in the measured bonding strength decreased within the first 2000 cycles, therefore, the test has been extended by a further 1000 cycles.