Dynamic Current Balancing of Parallel Connected IGBT Devices using PCB Sensor for Integration in Power Modules
Konferenz: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
24.03.2020 - 26.03.2020 in Berlin, Deutschland
Tagungsband: ETG-Fb. 161: CIPS 2020
Seiten: 5Sprache: EnglischTyp: PDF
Autoren:
Tripathi, Ravi Nath; Omura, Ichiro (Kyushu Institute of Technology (KIT), 2-4 Hibikino, Wakamatsu-ku, Kitakyushu-shi, Japan)
Tsukuda, Masanori (Green Electronics Research Institute and KIT, 1-8 Hibikino, Wakamatsu-ku, Kitakyushu-shi, Japan)
Inhalt:
Dynamic current balancing is a crucial factor for parallel connected devices. It has to be considered as a prominent issue concerning the high reliability and lifetime of the power module as well as the power electronic converter system. This paper presents, dynamic current balancing among the parallel-connected discrete IGBT devices using a tiny PCB sensor that can be integrated inside a power module for system miniaturization. The output of the tiny PCB sensor is used for current peak detection to perform gate delay compensation through feedback control. Moreover, the currents are also measured using Pearson current probe for authentication of measurement and system performance using PCB sensors.