Magnetic flux signal simulation with 16-channel sensor array to specify accurate IGBT current distribution
Konferenz: CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
08.03.2016 - 10.03.2016 in Nürnberg, Deutschland
Tagungsband: CIPS 2016
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Tsukuda, M. (City of Kitakyushu, 1-8 Hibikino, Wakamatsu-ku Kyushu Institute of Technology, 1-1 Sensui-cho, Tobata-ku, Kitakyushu, Japan)
Matsuo, K.; Noda, R. (C.D.N. Corporation, 1-18-22 Ohtsubo-higashi, Miyazaki, Japan)
Tomonaga, H.; Omura, I. (Kyushu Institute of Technology, 1-1 Sensui-cho, Tobata-ku, Kitakyushu, Japan)
Okoda, S. (COPER ELECTRONICS LTD., 43 Funako, Atsugi, Japan)
Tashiro, K. (HOH KOH SYA Co., Ltd., 2-7-30 Kamiitouzu, Kokurakita-ku, Kitakyushyu, Japan)
Inhalt:
Current crowding of IGBT and power diodes in a chip or among chips is a barrier to the realization of highlyreliable power modules and power electronics systems. Current crowding occurs because of stray inductance imbalance, difference of chip characteristics and temperature imbalance among chips. Although current crowding among IGBT or power diode chips has been analyzed by numerical simulation, no sensor with sufficiently high special resolution and fast measurement time has yet been developed. Therefore, we developed a 16-channel sensor array and demonstrated IGBT current distribution imaging. By using the developed simulation method for the sensor array, the accuracy of the magnetic flux signals was confirmed. In future work, we will apply the simulation method to specify the IGBT current distribution corresponding to the structure of bonding wire and other wiring