Full SiC power module with substrate integrated liquid cooling for battery electric vehicles
Konferenz: CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
08.03.2016 - 10.03.2016 in Nürnberg, Deutschland
Tagungsband: CIPS 2016
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
An, Bao Ngoc; Bernd, Martin; Leyrer, Benjamin; Blank, Thomas; Weber, Marc (Institute for Data Processing and Electronics (IPE), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany)
Loges, Andre (Institute of Thermal Process Engineering (TVT), Karlsruhe, Institute of Technology (KIT), Karlsruhe, Germany)
Wetzel, Thomas (Institute of Thermal Process Engineering (TVT), Karlsruhe, Institute of Technology (KIT); Karlsruhe, Germany)
Kolb, Johannes (SHARE am KIT - Schaeffler Technologies AG & Co. KG, Karlsruhe, Germany)
Inhalt:
We design and build a novel, full SiC power module based on a copper thick-film substrate with integrated liquid cooling. The cooling performance of the novel power module is compared with a copper thick-film printed power module soldered to a copper baseplate and attached to a conventional cold plate. Preliminary thermal simulations of both power modules show that the thermal resistance of the substrate integrated liquid cooling module is 7 % lower in comparison to the conventional power module. However, the thermal characterisation of both power modules reveals that, due to the very low coolant flow-rate, the presented power module has a lower cooling performance compared to the reference module. The conventional power module can discharge more than 50 W, whereas the presented power module can only conduct a maximum of 30 W of total power dissipation before the MOSFET temperature exceed 130 °C.