Microreplicated Pad Conditioner for Copper Barrier CMP Applications
Konferenz: ICPT 2012 - International Conference on Planarization / CMP Technology
15.10.2012-17.10.2012 in Grenoble, France
Tagungsband: ICPT 2012
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Zabasajja, John; Le-huu, Duy; Gould, Charles (3M Electronics Markets Material Division, St. Paul, MN 55144, USA)
Inhalt:
In this paper, a new, metal free, microreplicated pad conditioner with precisely engineered three dimensional diamond abrasive structures is demonstrated for barrier Chemical Mechanical Polishing (CMP) process. Extended marathon testing was conducted on the 300 mm AMAT Reflexion tool. Very stable thermal oxide and TEOS removal rates and non unifomities with low pad wear, low SP2 defectivity and surface finish were generated with multiple pads and slurries, demonstrating the flexibility and high performance of the microreplicated conditioner. Keywords: Planarization, Chemical-mechanical Polishing, Microreplication, marathon testing, stable removal rates, 3MTM TrizactTM Pad Conditioner