3-Dimensional, Solder-Free Interconnect Technology for High-Performance Power Modules
Konferenz: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
06.03.2012 - 08.03.2012 in Nuremberg, Germany
Tagungsband: CIPS 2012
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Mouawad, Bassem; Buttay, Cyril; Soueidan, Maher; Morel, Hervé; Allard, Bruno (Université de Lyon, INSA de Lyon, AMPERE-UMR 5005, Bât. L. de Vinci, 21 Av. J. Capelle, 69621 Villeurbanne Cedex, France)
Fabrègue, Damien (Université Lyon, INSA de Lyon, MATEIS-UMR 5510, Bât. B. PASCAL,7 Av. J. Capelle, 69621 Villeurbanne Cedex, France)
Bley, Vincent (Université de Toulouse, UPS, INPT, LAPLACE 118, route de Narbonne, 31062 Toulouse, France)
Inhalt:
The classical wire bonding has several drawbacks that make 3D structures a desirable technology for a high performance power module. An interconnection solution for the power semiconductor dies is presented here: it is based on copper micro-posts that are electroplated on top of the die. The die with its micro-posts is then assembled between two Direct Bonded Copper (DBC) substrates using a direct copper-to-copper bond method. This direct bond method is achieved using a Spark Plasma Sintering (SPS) process machine. Manufacturing and electrical characterization of a power semiconductor die with the micro-posts interconnection is presented in details.