Direct cooled modules - integrated heat sinks
Konferenz: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
06.03.2012 - 08.03.2012 in Nuremberg, Germany
Tagungsband: CIPS 2012
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Hohlfeld, Olaf; Herbrandt, Alexander (Infineon Technologies AG, Max-Planck-Str. 5, 59581 Warstein, Germany)
Inhalt:
Various cooling structures suitable for integrated water cooling including pin fin, folded and bonded structures have been compared. A jointing method has been presented, that allows the reliable mounting of substrates onto aluminium structures. A demonstrator with a cooling structure was manufactured and its reliability was tested.